Assembly capabilities

Roots Industries India Limited strengths in Design, Manufacturing, Infrastructure, Systems, Skill Sets and TQM practices enable it to offer High Mix, Low and Medium Volume Production along with Value Engineering and Product Data Management for the entire life cycle of the product. We have a State of the Art Facilities with infrastructure , including an exclusive line for RoHS, having  the expertise  and capability  to manufacture large range of SMD & THD boards with latest packaging of QFPs(QUAD Flat Package), Multiple BGAs(Ball Grid Array), LGAs(Land Grid Array)/QFNs(Quad Flat No Lead Packages), Fine Chip ICs , 0402/ 0201/ 01005 chips, Wire/Chip Bonding and provide new product development service from NPI to volume manufacture on Concept to Product basis.

ASSEMBLY CAPABILITIES

TECHNICAL CAPABILITIES

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